Quality improvement of printed circuit board: A case study of copper in hole

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Published: Aug 31, 2018
DOI: https://doi.org/10.14456/sehs.2018.9
Keywords:
defect reduction quality improvement copper in hole printed circuit board quality control circle

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Assadej Vanichchinchai
Faculty of Engineering, Mahidol University, Thailand. Corresponding author's e-mail: [email protected]
Wanwisa Duantrakoonsil
College of Logistics and Supply Chain, Sripatum University, Thailand

Abstract

The objective of this research is to reduce defective from copper in drilled hole of printed circuit board by adjusting 1) operating speed and retake rate of drill bit in CNC drilling step, 2) vacuum pressure for copper dust of dust collector in CNC drilling machine, 3) pressure and duration in cleaning step with high pressure ultrasonic and 4) life time of drill bit through uses of quality control circle methodology and simple quality improvement tools. Having adjusted this set of factors as a whole, defective from copper in hole was reduced significantly from 12.81% to 0.66% resulting in higher production capacity from lower defective. For future research, it is suggested to study the impact of individual factor and its most suitable value on copper in hole problem with more sophisticated quality improvement and statistical tools.


 

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How to Cite
Vanichchinchai, A., & Duantrakoonsil, W. (2018). Quality improvement of printed circuit board: A case study of copper in hole. Science, Engineering and Health Studies, 12(2), 77–84. https://doi.org/10.14456/sehs.2018.9
Issue
Volume 12, Number 2 (May - August), 2018
Section
Research Articles

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